For Apple iPhone XS Max - 3D BGA Reballing Stencil Kit Motherboard Medium Layer Planting Tin Template - Mechanic

iPhone XS Max Middle Layer Reballing Template | Mechanic 3D Series Boost your repair success rate with the Mechanic 3D BGA Reballing Stencil. Specifically built for the iPhone XS Max motherboard, this template delivers dependable operation and optimal performance for complex board-level repairs. Its durable build protects against wear during daily professional usage, making it a staple for any serious technician's bench.

• Precision Tin Planting: Square-hole design prevents solder paste from sticking.

• Accuracy-Driven: Reduces the risk of short circuits between motherboard layers.

• Professional Grade: Built to withstand the rigors of heavy-duty soldering.