For Apple iPhone 6 Plus - IC Chip BGA Direct Heating Reballing Stencil Template

iPhone 6 Plus BGA Reballing Stencil | Direct Heat Resistant | High-Precision Steel Achieve perfect solder ball alignment with this professional-grade BGA reballing stencil for the iPhone 6 Plus. Laser-cut for extreme accuracy, this template features square-hole technology for easier solder paste release and uniform ball formation. Engineered from high-tensile, heat-resistant steel, it remains flat under direct heat, effectively preventing "bridging" or "cold solder" joints during advanced logic board repairs.