For Apple iPhone 6s Plus - IC Chip BGA Direct Heating Reballing Stencil Template

iPhone 6s Plus BGA Reballing Stencil | Direct Heat Resistant Template Achieve perfect solder ball alignment with this high-precision BGA reballing stencil, specifically designed for the iPhone 6s Plus. Crafted from premium stainless steel, this template is engineered for direct heating without warping. The CNC-machined square holes ensure consistent solder paste application, making it the essential tool for professional IC chip repairs and motherboard restoration.