For iPad Pro 9.7 (2016) - 10.5 (2017) - 12.9 (2015) - Wylie BGA Square Hole Reballing Stencil - Black

Achieve factory-standard solder joints during motherboard-level repairs with this Wylie High-Precision Reballing Stencil. Specifically designed for the iPad Pro series (A1673, A1701, A1584), this stencil features the signature "Square Hole" design which prevents solder paste bridging and ensures uniform ball height across high-density BGA (Ball Grid Array) chips. It is the definitive solution for CPU/GPU reflowing, NAND flash upgrades, and PMIC replacements. Upgrade your gadget toolkit with this stencil; built with high-quality materials, it improves efficiency and helps your device perform flawlessly every single day.