For Apple iPhone 6s , 6s Plus - QianLi iBlack 2D Apple A9 CPU Chip BGA Stencil Template - Black

Master Level Precision: QianLi iBlack 2D A9 CPU Stencil Achieve perfect reballing results with the industry-standard QianLi iBlack 2D Stencil for the Apple A9 CPU (iPhone 6s / 6s Plus). Engineered for elite technicians, this stencil eliminates the frustration of bridged solder balls and heat-warping during complex logic board repairs.

• High-Temp Resistance: Specialized "Black" coating prevents thermal expansion and stencil bulging.

• Laser-Cut Accuracy: Square-hole design ensures consistent solder paste release for perfectly uniform BGA balls.

• Pro-Fit Alignment: Designed specifically for the A9 SoC and its surrounding RAM pads.