For Apple iPhone 11 , 11 Pro , 11 Max - Wylie BGA Square Hole Reballing Stencil A13 - Black

Master the A13: Wylie Square-Hole BGA Reballing Stencil Achieve factory-level precision on your most complex logic board repairs. This Wylie stencil is specifically engineered for the iPhone 11 series (A13 CPU). The advanced square-hole design ensures that solder paste is distributed evenly and released perfectly, eliminating the common "bridging" or "stuck ball" issues found with traditional round-hole stencils.

• Anti-Bulge Technology: Crafted from high-grade heat-resistant steel that remains flat even under high-temperature air stations.

• Precision Square Holes: Facilitates easier solder ball formation and cleaner stencil removal.

• Black Finish Edition: High-contrast coating reduces glare under the microscope, making pin alignment faster and easier on the eyes.